Thank you, Steve. As usual, your efforts are appreciated. Best regards, Leo Leo M. Higgins III, Ph.D. Director of Applications Engineering ASAT, Inc. 3755 Capital of Texas Highway, Suite 100 Austin, Texas 78704 ph 512-383-4593 fx 512-383-1590 [log in to unmask] www.asat.com The information contained in this electronic message is CUSTOMER/SUPPLIER PRIVILEGED AND CONFIDENTIAL INFORMATION intended only for the use of the individual or entity named above. If the reader of this message is not the intended recipient, you are hereby notified that any dissemination, distribution and copying of this communication is strictly prohibited. If you have received this communication in error, please immediately notify the sender by electronic mail. Thank you. -----Original Message----- From: [log in to unmask] [mailto:[log in to unmask]] Sent: Wednesday, June 22, 2005 7:37 AM To: TechNet E-Mail Forum; Leo Higgins Cc: [log in to unmask] Subject: Re: [TN] BGA Intermittent Saga, part 2 Good Mornin' Leo and Everyone! Well, today is starting off really good! (but I just got in...hehehe). Your two pictures are up Leo. Go to: http://www.stevezeva.homestead.com and click on Picture Page 2, and look for; "No Nickel Corrosion, and Nickel Corrosion". Kind regards, -Steve Gregory- Senior Process Engineer LaBarge Incorporated Tulsa, Oklahoma (918) 459-2285 (918) 459-2350 FAX |---------+----------------------------> | | Leo Higgins | | | <Leo_Higgins@ASAT| | | .COM> | | | Sent by: TechNet | | | <[log in to unmask]>| | | | | | | | | 06/21/2005 11:18 | | | PM | | | Please respond to| | | TechNet E-Mail | | | Forum; Please | | | respond to Leo | | | Higgins | | | | |---------+----------------------------> >--------------------------------------------------------------------------- -----------------------------------| | | | To: [log in to unmask] | | cc: | | Subject: Re: [TN] BGA Intermittent Saga, part 2 | >--------------------------------------------------------------------------- -----------------------------------| I will send a pair of pictures from an Amkor paper showing optical micrographs showing Ni corrosion and a pad with no Ni corrosion to Steve to see if he can put up on his web site. Published studies on Black Pad issues often show similar structures. Steve can you post the 2 photos? I will send after this note. Best regards, Leo Director of Applications Engineering ASAT, Inc. 3755 Capital of Texas Highway, Suite 100 Austin, Texas 78704 ph 512-383-4593 fx 512-383-1590 [log in to unmask] www.asat.com The information contained in this electronic message is CUSTOMER/SUPPLIER PRIVILEGED AND CONFIDENTIAL INFORMATION intended only for the use of the individual or entity named above. If the reader of this message is not the intended recipient, you are hereby notified that any dissemination, distribution and copying of this communication is strictly prohibited. If you have received this communication in error, please immediately notify the sender by electronic mail. Thank you. -----Original Message----- From: [log in to unmask] [mailto:[log in to unmask]] Sent: Monday, June 13, 2005 2:16 PM To: [log in to unmask]; [log in to unmask] Subject: RE: [TN] BGA Intermittent Saga, part 2 You state to look for Au cyanide etching in the eless Ni. With what instrument or is this under a high power micro scope (1000X). Can you describe what to look for or perhaps you can share a photo of the artifact you are suggesting. Victor, -----Original Message----- From: TechNet [mailto:[log in to unmask]] On Behalf Of Leo Higgins Sent: Monday, June 13, 2005 1:39 PM To: [log in to unmask] Subject: Re: [TN] BGA Intermittent Saga, part 2 Excessive stress from pneumatic presses used to bond heat sinks to BGAs after board level assembly has been shown to induce failure at the solder to BGA pad on packages that meet pre-SMT assembly quality specs in all ways. Subsequent analyses may show no evidence of black pad (cross sectioning to look for Au cyanide etching into the eless Ni, etc.). Best regards, Leo Director of Applications Engineering ASAT, Inc. 3755 Capital of Texas Highway, Suite 100 Austin, Texas 78704 ph 512-383-4593 fx 512-383-1590 [log in to unmask] www.asat.com The information contained in this electronic message is CUSTOMER/SUPPLIER PRIVILEGED AND CONFIDENTIAL INFORMATION intended only for the use of the individual or entity named above. If the reader of this message is not the intended recipient, you are hereby notified that any dissemination, distribution and copying of this communication is strictly prohibited. If you have received this communication in error, please immediately notify the sender by electronic mail. Thank you. -----Original Message----- From: TechNet [mailto:[log in to unmask]]On Behalf Of Jana Carraway Sent: Monday, June 13, 2005 1:01 PM To: [log in to unmask] Subject: Re: [TN] BGA Intermittent Saga, part 2 Werner, If it's black pad on the component side, how would Kerry prove or disprove it? Could he find the cause by using Auger or cross-section? What would be the appropriate tests to perform to find root cause? Should he send a component back to the supplier for root cause analysis? Thank you, Jana Carraway Jana Carraway MSEI - Advanced Technology Group 6024 S.W. Jean Road Lake Oswego, OR 97035 503.697.5291, ext 1180 email: [log in to unmask] -----Original Message----- From: TechNet [mailto:[log in to unmask]]On Behalf Of Werner Engelmaier Sent: Monday, June 13, 2005 10:04 AM To: [log in to unmask] Subject: Re: [TN] BGA Intermittent Saga, part 2 Hi Kerry, You most likely have 'Black Pad' on the componet side. That, together with the stess concentration from the SMD-geometry, caused a briitle ionterfacial overstress failure. Regards, Werner Engelmaier Engelmaier Associates, L.C. 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