John, You're right. I'm the perfect example...how many times have I posted to the TechNet about solder mask problems? How many times have those posts had to do with dry film solder masks? I rest my case. I wish there was someway I could get our customers who use dry film mask switch to LPI, but I can't. When I ask why they won't consider switching, the standard answer usually is; "Because that's what we've always used..." It's hard to argue with that... Kind regards, -Steve Gregory- Senior Process Engineer LaBarge Incorporated Tulsa, Oklahoma (918) 459-2285 (918) 459-2350 FAX |---------+----------------------------> | | John Parsons | | | <jparsons@ENIGMAC| | | ORP.COM> | | | Sent by: TechNet | | | <[log in to unmask]>| | | | | | | | | 06/03/2005 10:56 | | | AM | | | Please respond to| | | TechNet E-Mail | | | Forum; Please | | | respond to John | | | Parsons | | | | |---------+----------------------------> >--------------------------------------------------------------------------------------------------------------| | | | To: [log in to unmask] | | cc: | | Subject: Re: [TN] Dry Film "Soda Strawing"...an update. | >--------------------------------------------------------------------------------------------------------------| For more years than I care to remember I have always been under the impression that dry film mask caused more problems with SMT assembly than it solved because of issues of coplanarity or lack thereof. I know that it can provide better tenting abilities but is the rest of my thinking somewhat outdated? John -----Original Message----- From: Dehoyos, Ramon [mailto:[log in to unmask]] Sent: Friday, June 03, 2005 5:27 AM To: TechNet E-Mail Forum; John Parsons Subject: RE: [TN] Dry Film "Soda Strawing"...an update. Dry film is capable of providing greater thickness than LPI. It keeps solder paste from shorting across to other pads. One of probably few advantages. Ramon -----Original Message----- From: TechNet [mailto:[log in to unmask]]On Behalf Of John Parsons Sent: Thursday, June 02, 2005 7:01 PM To: [log in to unmask] Subject: Re: [TN] Dry Film "Soda Strawing"...an update. Not to hijack Steve's thread but what would be the reasoning for applying the dryfilm mask over LPI? What would be the benefits here? Within our customer base we never get calls for dryfilm mask so I am not clear on it's preferred application. Steve's customers sure seem to like it! It does seem somewhat problematic for him though :o) . John Parsons -----Original Message----- From: TechNet [mailto:[log in to unmask]] On Behalf Of Bob Metcalf Sent: Thursday, June 02, 2005 3:49 PM To: [log in to unmask] Subject: Re: [TN] Dry Film "Soda Strawing"...an update. Steve, While it is not an "easy" process, I know a number of companies that have done the dry over liquid process for several years. Your fab shop needs to verify the LPI is compatible with the dry film and there are a few tricks to make it easier. If you contact one of the solder mask services (Solder Mask Inc, Mask Tek etc) they can do the job for your vendor or perhaps give them some tips to help them do it themselves. Regards, Bob --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 ----------------------------------------------------- --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 ----------------------------------------------------- __________________________________________________________________ This message may contain information that is privileged and confidential to LaBarge, Inc. 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In such event, you should destroy the message and kindly notify the sender by reply e-mail. --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 -----------------------------------------------------