Hi, is there anyone that could inform me about the new lead-free HAL process specifications. What is the new dwell time, temperature? If we want to use CEM1 material, is there any disease probability bsecause of the thermal shock, etc. I'll be appreciated if anyone can advice me information sources about the new HAL procedures (Solder thickness, temperature range, dwell time, solder bath material, etc.) Thanks for all responses Best regards Ferit --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 -----------------------------------------------------