I'm trying to clearly confirm the level of phosphorus at which the solderability of electroless nickel starts to be severely reduced. Traditionally, I always thought it was 5%. I colleague of mine claims that he's got a paper from 89' at the "Electroless Ni Conference" that states that up to 3% is no problem. I do recall seeing an article last year where 6 to 8% seems to be the preferred maximum . Any thoughts on what the appropriate level should be, and/or the mechanism of why it is it degrades solderablity would be truly appreciated. Rich K - KEDS --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 -----------------------------------------------------