It's been a lot of e-mails on the issue but do we know where the openings are and how they look. Is there a cross-sectioned view of at least one of the joints in question? Regards, Vladimir Sent from my Blackberry Wireless Vladimir Igoshev, 519-888-7465 ext.5283 -----Original Message----- From: TechNet <[log in to unmask]> To: [log in to unmask] <[log in to unmask]> Sent: Tue May 24 09:57:23 2005 Subject: Re: [TN] BGA Intermittent Hi Kerry: Too much of a soak time will burn off the resin. What type of profile is it being used, RTS ( ramp to spike ) or RSS ( ramp soak and spike )? Can you share the profile temps and chain speed? Regards, Ramon -----Original Message----- From: TechNet [mailto:[log in to unmask]]On Behalf Of Black, Paul Sent: Tuesday, May 24, 2005 9:11 AM To: [log in to unmask] Subject: Re: [TN] BGA Intermittent Kerry, We are currently experiencing the same type of failure with a smaller BGA, and hired an outside firm to run a battery of tests. The conclusion that I received yesterday was that the BGA is probably failing due to resin starvation. The way it was explained to me is that, during the press curing of the device, too much resin may have been forced out of it, resulting in voids in the dielectric layer. This causes stress on the BGA substrate vias and can lead to fractures within the internal Copper traces. This has not been confirmed yet by the manufacturer, but it's something you might want to keep in mind. Thank you, Paul Black Manufacturing Engineer Kronos E-mail: [log in to unmask] Voice: (978) 947-1520 Fax: (978) 244-0568 www.kronos.com Improving the Performance of People and Business(tm) -----Original Message----- From: TechNet [mailto:[log in to unmask]]On Behalf Of Kerry McMullen Sent: Tuesday, May 24, 2005 8:17 AM To: [log in to unmask] Subject: Re: [TN] BGA Intermittent Hi Leo, If pressure is applied to the part, the part functions (passes data). When the slight finger pressure is let off, the part fails (no data passes). Leo Higgins <[log in to unmask]> 05/23/2005 05:31 PM To "'TechNet E-Mail Forum'" <[log in to unmask]>, "[log in to unmask]" <[log in to unmask]> cc Subject RE: [TN] BGA Intermittent Can you define what you mean by "intermittent"? Does this mean measurements on the same board show proper functionality but repeated measurements show that improper operation is sometimes noted? How is this measured....some form of ICT? Best regards, Leo Director of Applications Engineering ASAT, Inc. 3755 Capital of Texas Highway, Suite 100 Austin, Texas 78704 ph 512-383-4593 fx 512-383-1590 [log in to unmask] www.asat.com The information contained in this electronic message is CUSTOMER/SUPPLIER PRIVILEGED AND CONFIDENTIAL INFORMATION intended only for the use of the individual or entity named above. If the reader of this message is not the intended recipient, you are hereby notified that any dissemination, distribution and copying of this communication is strictly prohibited. If you have received this communication in error, please immediately notify the sender by electronic mail. Thank you. -----Original Message----- From: TechNet [mailto:[log in to unmask]]On Behalf Of Kerry McMullen Sent: Monday, May 23, 2005 1:01 PM To: [log in to unmask] Subject: Re: [TN] BGA Intermittents Hi Paul, I am going to check now. We have not had the problem before. Kerry Kerry McMullen Principal New Product Mfg. Engineer LTX Corporation 50 Rosemont Road Westwood, MA 02090-2306 (T) 781-467-5468 Paul Edwards <[log in to unmask]> 05/23/2005 01:40 PM To TechNet E-Mail Forum <[log in to unmask]>, [log in to unmask] cc Subject RE: [TN] BGA Intermittents Kerry, What size are the BGA pads and balls? Paul Edwards Process Engineering [log in to unmask] Tel: 408-433-4700 FAX: 408-433-9988 Surface Art Engineering 81Bonaventura Dr. San Jose, CA 95134 DUNS: 944740570 CAGE/NCAGE: 1XZ48 -----Original Message----- From: Kerry McMullen [mailto:[log in to unmask]] Sent: Monday, May 23, 2005 10:31 AM To: [log in to unmask] Subject: Re: [TN] BGA Intermittents Hi Technetters, Typing too fast. Balls are 63/37. Ball temperature near the middle balls measured by thermocouple is 206 Degrres C. I do not want to go any higher as I might damage some of the other components on the board. The board is 12" x 12" double sided. I'm not sure if the design engineers are creating a fire drill here, or not. First they say its the middle. Today it is the corners. The boards pass x-ray (non-oblique). The boards have not warped at all. Very balanced board both in layer thickness and Cu dispersion. The only thing I have not found is the surface finish on the BGA substrate. I doubt it is the profile..... Thanks in advance for your help. Kerry Bev Christian <[log in to unmask]> Sent by: TechNet <[log in to unmask]> 05/23/2005 01:21 PM Please respond to TechNet E-Mail Forum <[log in to unmask]>; Please respond to Bev Christian <[log in to unmask]> To [log in to unmask] cc Subject Re: [TN] BGA Intermittents Kerry, Pure tin balls?! I have not heard of that before. Pure tin melts considerably higher than SAC alloys. Hmm, 206C you say, 14 layer board? It is quite possible that your temperature/time is not enough to get a significant amount of diffusional mixing of the solder paste and the balls. But then you mention intermittents at the corners as well as the center. Two other possibilities are warping of the part (but would expect that to give you intermittents in one or the other area, not both) or there is a severe problem with the construction of the component itself and there is internal damage to the component. You don't say, but I presume the board itself solders well and there are no other soldering problems on the board that would lead you to suspect the solder paste? Bev RIM -----Original Message----- From: TechNet [mailto:[log in to unmask]]On Behalf Of Kerry McMullen Sent: May 23, 2005 1:10 PM To: [log in to unmask] Subject: [TN] BGA Intermittents Hi Technetters, I have a 1089 BGA with Sn balls. Paste is 63/37 SnPb Board is 14 layer, .098 thick Immersion Ag. Ran thermocouples. Inner balls are seeing 206 degrees C. What could be causing intermittents at the center and corners of the BGA? Thanks, --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 ----------------------------------------------------- Kerry --------------------------------------------------------------------- This transmission (including any attachments) may contain confidential information, privileged material (including material protected by the solicitor-client or other applicable privileges), or constitute non-public information. 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