A lot of this testing parallels with the specific packages themselves. Cleaning a die prior to under fill. -----Original Message----- From: Stadem, Richard [mailto:[log in to unmask]] Sent: Thursday, May 19, 2005 10:35 AM To: TechNet E-Mail Forum; Charlie Pitarys Subject: RE: [TN] BGA test coupon Importance: Low So why don't you use SIR or ROSE testing? I would think that would be more reliable than visual inspection, as these types of flux residues may not be easily visible, even under a glass-bodied BGA. -----Original Message----- From: TechNet [mailto:[log in to unmask]] On Behalf Of Charlie Pitarys Sent: Thursday, May 19, 2005 9:29 AM To: [log in to unmask] Subject: [TN] BGA test coupon Hello all, In pursuit of better cleaning I am looking for a supplier or creative inventor that has a BGA style device/component (pick a size) where the top is clear and you can look through and see if any flux residue remains around the bump pattern. My method currently employs heating up the substrate and popping off the die,etc. The heat can skew the visual data by reheating and/or volatilize any flux remaining etc. Plus if you have had too much coffee during the day this exercise can get a little dicey! I don't want to invest 30K for a spy scope either. I know about the glass slide deal for cleaning and I am not a big fan of it. 20+ yrs in this biz and this test method is too labor intensive and is only designed to fail IMHO. TIA Charlie Pitarys 603.622.2900 x-115 --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 ----------------------------------------------------- --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 -----------------------------------------------------