Hi John,

That is correct, see IPC SM-782 rev A amendment 2, section 14.

Brent


-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of John Guy
Sent: Tuesday, May 10, 2005 12:59 PM
To: [log in to unmask]
Subject: [TN] BGA Ball/Pad Size Ratio

Hello All,
        I was wondering if there is some guideline for the recommended
pad size for a BGA based on the component's ball size?  I have been told
that it is recommended that the pad diameter be about 80% of the ball
diameter, but I would like some confirmation.

Thanks in advance,
John Guy
Surface Mount Process Engineer
diversifiedsystems, inc.
Custom Products Division
3939 W. 56th Street
Indianapolis, IN 46254-4961

Telephone: 317-299-9547, x336
Fax: 317-298-2055
E-mail: [log in to unmask]
Web: www.divsys.com

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