I haven't seen the bubbling with dryfilm soldermasks, but I do know that the dryfilm soldermasks can't go thru washes that exceed 140C temperatures. The first symptoms will be white hazing. Thank you, Eddie Rocha South Bay Circuits Hi All... Boy, I hope your day is going better than mine... One of my inspectors called me to to look at an assembly she had. I came to her station and started looking at the assembly, and just about cried (not really). I observed something that I've seen before... The solder mask is losing adhesion from all copper features, traces, vias, everything copper. This starts occuring after about 2-3 wash cycles in our batch cleaner. Take a look at; "Mask Bubble, Mask Bubble 2, 3, and 4", at: http://www.stevezeva.homestead.com I've seen this before and thought we had the problem taken care of. It's caused by the chemistry we use to clean RMA flux residues, not being compatible with certain dryfilm solder masks. We use Kyzen Aquanox 4512P in the manufacturers recommended concentration, and we see this problem everytime a Dynachem Dynamask (now Shipley) dry film is used. We used to use Aquanox XJN and had the same problem. On our PO's we have a note that when dry film solder mask is called out on the fab drawing, use Dupont Vacrel series dry films, as we know that we have absolutely no problem with Vacrel. The last time I had this problem and posted about it, there were a few responses that I shouldn't be having these problems, that the Dynachem Dynamask dry films are very robust. But I swear, everytime I see the mask bubbling and flaking like you see in the images I've posted, it turns out that a Dynachem dry film was used. Can I be the only one that has these probelms? Kind regards, -Steve Gregory- Senior Process Engineer LaBarge Incorporated Tulsa, Oklahoma (918) 459-2285 (918) 459-2350 FAX __________________________________________________________________ This message may contain information that is privileged and confidential to LaBarge, Inc. It is for use only by the individual or entity named above. If you are not the intended recipient, you may not copy, use or deliver this message to anyone. In such event, you should destroy the message and kindly notify the sender by reply e-mail. --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 ----------------------------------------------------- --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 -----------------------------------------------------