Steve: Do they spec out a Tin/Lead thickness, or whether the Tin/Lead should be reflowed? Jeff Bush and I are really talking about two different kinds of finishes. I have seen thin Tin/Lead, non-fused. Could not fathom designing a board with this finish. Jeff Bush is talking about Thick Tin/Lead, which is fused, not an easy board to build, but shelf life is not an issue. Rudy Sedlak Stephen Gregory <[log in to unmask]> wrote: Hi Jeffery, The board that I'm talking about doesn't seem to be that old design-wise. So do you think that maybe the note is just something kind of got "boiler-plated" from earlier designs? A description of the board is that it is a VME styled board, and everything on the board is SMT including headers, right angle push button switches, etc., the only through-hole is two press-fit right angle connectors. So the board is never going to see wave solder. The board is 15-layers and only .065" thick. Do you think that maybe the reason they have the note prohibiting HASL is because they don't want to thermally shock the board which may cause other problems? Kind regards, -Steve Gregory- Senior Process Engineer LaBarge Incorporated Tulsa, Oklahoma (918) 459-2285 (918) 459-2350 FAX |---------+-----------------------------> | | Jeffrey Bush | | | | | RCUITS.COM> | | | Sent by: TechNet | | | | | | | | | | | | 05/17/2005 06:57 | | | AM | | | Please respond to | | | TechNet E-Mail | | | Forum; Please | | | respond to Jeffrey| | | Bush | | | | |---------+-----------------------------> >--------------------------------------------------------------------------------------------------------------| | | | To: [log in to unmask] | | cc: | | Subject: Re: [TN] SMOBC question... | >--------------------------------------------------------------------------------------------------------------| This process is called selective solderstrip and is incorporates removing the tin/lead plating from masked areas, applying the mask then reflowing the tin/lead plating to a solder finish. This is from a time when HASL was new and not very robust - issues existed with the thickness of the HASL deposit and problems were noted in assembly from inadequate solder coating. The tin/lead reflow process offer a much thicker solder alloy on the PCB and avoided the thickness issue. This process worked best with hot-oil reflow as the tin/lead plating was contaminated from photo resist development and when LPI was introduced, mask developing. I do not see this as an issue today with a well controlled HASL process. Jeffrey Bush Director, Quality Assurance and Technical Support VERMONT CIRCUITS INCORPORATED 76 Technology Drive - POB 1890 Brattleboro, Vermont 05302 Voice: 802.257.4571.21 Fax: 802.257.0011 http://www.vtcircuits.com -----Original Message----- From: Stephen Gregory [mailto:[log in to unmask]] Sent: Monday, May 16, 2005 7:50 PM To: [log in to unmask] Subject: [TN] SMOBC question... This may seem like a strange question, but here it is: Can a board have a tin/lead finish on the solderable surfaces when SMOBC is called out, and comply with a note on the drawing that SPECIFICALLY states that HASL is not allowed? I have a fab vendor that's telling me that it's not possible. SMOBC without HASL can't happen, if you want a tin/lead finish on the pads...is that true? I've been told that there will be some areas that will wind-up having a tin/lead finish beneath the soldermask, which we all know isn't a good thing because of the loss of adhesion of the mask when the assembly goes thru reflow or wave solder. Kind regards, -Steve Gregory- Senior Process Engineer LaBarge Incorporated Tulsa, Oklahoma (918) 459-2285 (918) 459-2350 FAX __________________________________________________________________ This message may contain information that is privileged and confidential to LaBarge, Inc. It is for use only by the individual or entity named above. 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