Hi Arnaud, IPC LF Listservers,

Bulk properties prior to attachment is about the only way I can see any of
them determining the composition for reporting. Bulk, of course gets over
the 1g limit.

<What is the best lab. method to 'precisely' determine the composition of
lead free solder balls of unassembled LF area array components like CSP
or BGA? It is my understanding that ICP-AES requires a great amount of
material (1g) and cannot apply to a single package.
How do the component manufacturers proceed for their material
declarations about LF solder balls?>
< <Best regards, <A. Grivon

Yours in Engineering, Dave
YiEngr, MA/NY DDave

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