Hi Arnaud, IPC LF Listservers, Bulk properties prior to attachment is about the only way I can see any of them determining the composition for reporting. Bulk, of course gets over the 1g limit. <What is the best lab. method to 'precisely' determine the composition of lead free solder balls of unassembled LF area array components like CSP or BGA? It is my understanding that ICP-AES requires a great amount of material (1g) and cannot apply to a single package. How do the component manufacturers proceed for their material declarations about LF solder balls?> < <Best regards, <A. Grivon Yours in Engineering, Dave YiEngr, MA/NY DDave -------------------------------------------------------------------------------Leadfee Mail List provided as a service by IPC using LISTSERV 1.8d To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Leadfree To temporarily stop/(start) delivery of Leadree for vacation breaks send: SET Leadfree NOMAIL/(MAIL) Search previous postings at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 -------------------------------------------------------------------------------