Fellow TechNetters: - Does DIG Plating require a nickel barrier metal plating? - Does DIG Plating thin, etch, out the copper pad? - Does the step down region, etched, become critical? - Does the step down region have a criteria for acceptance? In a previous like I witness BGA failures at the step down region on the copper pad. A foil fractures occurred at the edge of the solder mask and the step down region of the copper pad. Any input from personal experiences will greatly be appreciated. Victor, --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 -----------------------------------------------------