TechNet, TI SC70-5 package. We're looking for input from anyone who has experienced problems achieving adequate solder joints with the TI SC70-5 package size. We have problems with cold solder joints and non-wetting. We feel the problem is tied to the Nickel/Palladium/Gold plating used by TI and the relatively short foot on an SC70-5 pkg. We have seen considerable improvement when using other manufacturers. We use Kester R562 water soluble solderpaste; alloy 62/36/2Ag; Mesh -325/+500 on MacDermid Immersion Silver boards. Thanks, Larry --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 -----------------------------------------------------