TechNet, 

TI SC70-5 package.  We're looking for input from anyone who has
experienced problems achieving adequate solder joints with the TI SC70-5
package size.  We have problems with cold solder joints and non-wetting.
We feel the problem is tied to the Nickel/Palladium/Gold plating used by
TI and the relatively short foot on an SC70-5 pkg.  We have seen
considerable improvement when using other manufacturers.  We use Kester
R562 water soluble solderpaste; alloy 62/36/2Ag; Mesh -325/+500 on
MacDermid Immersion Silver boards.  
 
Thanks, 
Larry 

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