Hi Steve, alert experts already online. I have two pictures on Nickel plated AlSiC, chemistry and who did it can I not shout out just now, except that it's perfecly free from P, very very 100% Ni. It's greyish, dull and matte, and very good for 60Sn soldering, at least speaking wetting. Now, we suspect something happens after soldering the glass RF glass beads for SMA. Hermeticity becomes leakers, not gross, but enough for rejection. I suspect some kind of fragile interface layers, cross sections indicate that, but suspected region is much less than micron thick and hard to study. When you look at the pics on Steve's mousetrap gallery, what do you think about the very tiny superficial items, grains or nanonuggets or columns or how they can be caracterised as...do you think they are pure nickel too? Are they atomary bound to the bulk plating or vagabonds that don't take part in the serious solder-nickel wedding party? If you bite on a gold dollar you'll have to go through a thin layer of human debris and stuff from the underwares first...best I could compare with. Can there be such a 'debris' layer on top of nickel plating too, and if so, how do I get rid of it? The pics are 10k resp 20k magnification. Crazy q, not optimistic about answer.. Ingemar Hernefjord Ericsson Microwave Systems -----Original Message----- From: TechNet [mailto:[log in to unmask]] Sent: den 5 april 2005 15:45 To: [log in to unmask] Subject: [TN] Mousebites... Mornin' all ya'll! Came back in this morning and looked at the fabs that I posted about yesterday some more. We're going to reject them. Not just because of the mousebites on the annular pads, but we've discovered that there are mousebites all over everything. In some cases reducing the trace widths. Take a look at; "Mousebites 1-4" at: http://www.stevezeva.homestead.com If it were just the annular pads, we might have accepted them. But not with them occuring all over the fab like this. Kind regards, -Steve Gregory- Senior Process Engineer LaBarge Incorporated Tulsa, Oklahoma (918) 459-2285 (918) 459-2350 FAX __________________________________________________________________ This message may contain information that is privileged and confidential to LaBarge, Inc. It is for use only by the individual or entity named above. If you are not the intended recipient, you may not copy, use or deliver this message to anyone. In such event, you should destroy the message and kindly notify the sender by reply e-mail. --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 ----------------------------------------------------- --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 -----------------------------------------------------