You might also verify with your board house that it is indeed silver under the mask. I've heard of leaving electrolytic tin on the copper surface, applying LPI solder mask and then tin stripping the panel to prepare surface for immersion platings. This may address poor tin stripping issues prior to mask or poor LPI developing/rinsing prior to final finishing. "For the record your honor" I have not tried it nor thought of it. I am not that smart/desperate/daring etc. I wouldn't suggest it either. Best thing is to fix which ever process that is generating the difficulties. Technical service from the chemical people is essential at this point. Russ Burdick >From: "Stephen M. Vargas" <[log in to unmask]> >Reply-To: TechNet E-Mail Forum <[log in to unmask]>, "Stephen M. >Vargas" <[log in to unmask]> >To: [log in to unmask] >Subject: [TN] Immersion Silver >Date: Fri, 1 Apr 2005 07:42:26 -0600 > >Good Day All: > > A question arose at our factory regarding immersion silver surface >finish. We recieved boards where the solder masking was applied after the >immersion silver was applied to the PWB. Are there potential solder mask >adhesion issues with this? Should the solder mask be applied prior to >adding the surface finish? Any insight would be appreciated. Thanks. > >Regards, >Steve Vargas > >--------------------------------------------------- >Technet Mail List provided as a service by IPC using LISTSERV 1.8e >To unsubscribe, send a message to [log in to unmask] with following text in >the BODY (NOT the subject field): SIGNOFF Technet >To temporarily halt or (re-start) delivery of Technet send e-mail to >[log in to unmask]: SET Technet NOMAIL or (MAIL) >To receive ONE mailing per day of all the posts: send e-mail to >[log in to unmask]: SET Technet Digest >Search the archives of previous posts at: http://listserv.ipc.org/archives >Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 >for additional information, or contact Keach Sasamori at [log in to unmask] or >847-615-7100 ext.2815 >----------------------------------------------------- --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 -----------------------------------------------------