Had one back in '86 but it was steel which had been enamelled and then a circuit pattern printed on the top of the glass. John -----Original Message----- From: TechNet [mailto:[log in to unmask]]On Behalf Of Frederick Miller Sent: Thursday, April 14, 2005 10:37 AM To: [log in to unmask] Subject: Re: [TN] ENIG/ITO Does anyone have a sample of the steel board coated with epoxy? That is the first board I ever saw and it was at a Western Electric plant in Kearney NJ. ************************** Frederick H. Miller PE Astrolab, Inc. 4 Powder Horn Drive Warren, NJ 07059 Tel: 732-560-3800 Fax: 732-560-9570 www.astrolab.com [log in to unmask] ***************************** -----Original Message----- From: TechNet [mailto:[log in to unmask]]On Behalf Of R Sedlak Sent: Thursday, April 14, 2005 1:12 PM To: [log in to unmask] Subject: Re: [TN] ENIG/ITO Brian: It is ALMOST Friday, so I am allowed to make inane, (or maybe not so inane) suggestions.... about connecting the two sides of the proposed board... You are aware that PCB started out with RIVITS as the interconnection between the two sides? Rudy Sedlak RD Chemical Company.... Happy almost Friday Brian T <[log in to unmask]> wrote: Hello TechNetters, I've been tasked with researching material for a new project. This circuit board would have several unique characteristics. The base material would need to be rigid and transparent (acrylic or polycarbonate?). This double sided board would need a gold finished circuit (ENIG) on the primary side, on which a minimal number a components would mount. On the secondary side would be a pattern consisting of indium tin oxide (ITO). And cost is a concern (as always) as the final product will be disposable, with high production numbers. I know there are companies that plate or laser etch plastic to create molded interconnect devices (MID), and others that do laser patterning of ITO on plastic. But can both these processes be applied to one device, and is there one company that can do both? Any thoughts on making the interconnection between the two sides (conductive epoxy fill in vias maybe)? Are there any other options? This is vastly different than the low volume multi-layer FR4 boards our company usually does. Thanks for any help, Brian --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 ----------------------------------------------------- --------------------------------- Yahoo! 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