Technetters: On a large board (16" x 20"), some optofet relays (4-pin SMT SSOP4 package) are being "knocked off" during post-reflow assembly, handling, cleaning, or ??. The relays are located on both sides of the board. We mount temporary standoffs on the board (during some of the manual assembly whenever possible) to protect these and other parts, and have reduced the problem, but would like to eliminate the problem. Here's a link to manufacturers website to view the part: http://www.aromat.com/pcsd/product/pmos/pdf_cat/aqy221n2v.pdf#search='aqy221n2vy' We've added glue (chip bonder) dots to each side of the relay before placement, but that may (or seems to) be lifting the part slightly causing poor solder contact. Some questions: Are there IPC or industry specs. on the shear force a component should be able to handle? Would a post-reflow underfill work (the underside clearance is the height of the solder, maybe about .003")? Are other users of this part experiencing the same problem? As usual, thanks in advance for your responses, Al Kreplick Sr. Mfg. Eng. Teradyne, Inc. 500 Riverpark Drive Mail Stop NR500 1-1 North Reading, MA 01864 Tel: 978-370-1726 --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 ----------------------------------------------------- Pager: 888-561-6485