I occasionally see OL copper thickness specs where the finished thickness is called out in ounces of copper. For instance, 0.5 oz foil plated up to 2.0 oz. I'm not sure how to interpret this. The nominal thickness for 2.0 oz of copper comes out to be something like 2.75 mils (70 microns). But the 2 oz copper I use to build the boards doesn't come to me that thick and only needs to be 2.2 mils or 56 um by the time I'm done with it. Surely, I'm not the only one to see this. How are others treating this? Do you try to plate to 70 ums but accept 56 um as the minimum? Or is 70 um the minimum? Is there any industry standard anywhere that covers copper plating thickness in this method? Follow the copper foil road..... --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 -----------------------------------------------------