As more and more functions get place on/in chips, there is oftenly less need for superboards. Disappointed? Why? There are other areas of interest. E.g. the promising paper board, that was a topic years back, but disappeared. Imaging boards that can be put in any fire-place to keep your hands warm, when it's minus 40 on outside. Boards that do not contaminate atmosphere, nor water or ground during destruction. Boards with 50% less Copper. Maybe copper can be superseded by something else? Conductive polymers exist already. We are maybe trapped in traditions. I'm sure PWBs will look different in the future. Actually, there is a lot to do! Grab the challenge and make PWB revolution! And be rich.. Ingemar Hernefjord Ericsson Microwave Systems -----Original Message----- From: TechNet [mailto:[log in to unmask]] Sent: den 5 mars 2005 17:24 To: [log in to unmask] Subject: Re: [TN] Advanced plating The hot plating topic at IPC EXPO was NOT through-hole plating but BLIND-VIA plating. There were over 640 million cell phone made last year with most having two laser-drilled blind vias boards in them! The advanced technology is to replace high aspect ratio through hole plating with small-blind vias stacked on top of buried vias. The buried vias can be Via-in-Pad so the need is to have these vias plated solid so that they are flat for assembly. The unique property of these new copper plating baths is that they have very high throwing capability and are suited for horizontal or moving panel vertical plating equipment. That would mean that they probably due very well with high aspect ratio holes also. Happy Holden Westwood Associates Rich Olsen <[log in to unmask]> Sent by: TechNet <[log in to unmask]> 03/05/2005 09:58 AM Please respond to TechNet E-Mail Forum <[log in to unmask]>; Please respond to Rich Olsen <[log in to unmask]> To [log in to unmask] cc Subject [TN] Advanced plating Hello, What is being achieved today in advanced through hole plating? What is the "State-of the Art"? Thicker boards. Narrower holes. Higher aspect ratios. Is this being achieved by newer plating technologies, by doing different things with old technologies (longer plating times), or by "Holistic board manufacture" (Tight lamination, drill, desmear, photo, Mettalization and plating controls) Rich Olsen --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 ----------------------------------------------------- --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 -----------------------------------------------------