We had a similar issue, but in our case we had BGAs bumps instead of the leads. our symptom was overheating as the thermal slug did not get soldered properly, as the the stencil specifications was not correct ( thickness and aperture ). So we had insufficient solder. We opened up the aperture and added a test pad to check( at ICT) for continuity and hence positive contact of the solder and problem went away. However in the process of trouble shooting the issue, we also visited the coplanarity spec. The general rule of thumb is when you print 6 mil paste and reflow, one could approximate 50% reduction in height and in our case 4 mil gap made a positive contact of the solder bumps and the slug. This is my 2 cents worth. thanks --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 -----------------------------------------------------