Anyone has experience on laser ablation decap of components? I saw some very nice photo of localized decap components, PBGA to be specific, it decaped one section of the wire bonded part (approx. 1/16 of the chip location). What is the equipment? YAG? what is the power? who is the equipment maker in the field? Any recommendation or information on the methodology? Thank you very much for all your help. Best regards, jk --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 -----------------------------------------------------