Dear Technetters: In reviewing the myriad of BGA reliability tech papers there seems to be little commonality in the type of test protocols. There are tests that are industry specific, device vendor specific and customer specific. What guidance in terms of minimum mechanical solder joint strength and reliability testing would the knowledgeable designers (for CLASS II products)have for us? (We are NOT designers of circuit boards, systems or devices). Any test protocol standards? What would be the acceptance criteria for pass/fail be? What type of measurements would be required as a minimum? Best Regards Bob Wettermann Bob Wettermann --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 ----------------------------------------------------- PH 847-767-5745