First rule out the electroless line. Dummy plate some panels (electroless) then run them through your etcher. If they etch cleanly, move to the next step in the process. One of the other posts to your question mentioned lock in. Thats where I'd put my money. Another possibility though, based on your description that it appears to be spattered, is under developed resist redepositing on the panel in the developer. Underdeveloped resist is like goo that will deposit randomly across a panel. You can see it but you really have to be looking for it. It's pretty much colorless. To track it down I'd run some dummy panels, like I suggested for the electroless line. Laminate some panels; allow them to sit for the maximum amount of time a laminated panel will sit in your yellow room, develop it and etch it. I'd also run an unlaminated panel through the developer then etch it. If you are getting redeposited resist it will show up on the unlaminated panel. Good luck - hope this helps. pete >From: Rich Olsen <[log in to unmask]> >Reply-To: TechNet E-Mail Forum <[log in to unmask]>, Rich Olsen ><[log in to unmask]> >To: [log in to unmask] >Subject: [TN] Surface Contamination on Electroless Copper >Date: Sat, 26 Mar 2005 10:45:49 -0700 > >Hi, > > Has anyone seen the following? > Surface contamination on top of electroless copper. > It prevents plating and subsequent etching. > It is both under the resist and in exposed areas during pattern >plate and >etch. > It is small on the order of a mil or two, but there can be lots of >it. > It seems to be in streaks, a spattered appearance. > >thanks, >Rich > >--------------------------------------------------- >Technet Mail List provided as a service by IPC using LISTSERV 1.8e >To unsubscribe, send a message to [log in to unmask] with following text in >the BODY (NOT the subject field): SIGNOFF Technet >To temporarily halt or (re-start) delivery of Technet send e-mail to >[log in to unmask]: SET Technet NOMAIL or (MAIL) >To receive ONE mailing per day of all the posts: send e-mail to >[log in to unmask]: SET Technet Digest >Search the archives of previous posts at: http://listserv.ipc.org/archives >Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 >for additional information, or contact Keach Sasamori at [log in to unmask] or >847-615-7100 ext.2815 >----------------------------------------------------- --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 -----------------------------------------------------