Hello, I have a 44 pin .8mm pitch QFP which one would typically think no big deal. This device however have the heat slug underneath the device to dissipate the heat into the PWB. This slug has to be soldered but to keep the device from floating we quarter it to do a ~60% reduction on the pad area. The problem is we occasionally get several leads with the foot-in- the-mud defects. Considering all of the other pins wetted well and only a couple pins are sitting on top of the solder my experiences tell me co- planarity. We talked to the device manufacturer and they claim the parts are checked prior to being packaged in trays and should be good. We sent two batch to a programming house to have the leads checked and they failed ~2%. At this point the device manufacturer is disputing/verifying the failures. My question is: Does anybody know what industry standard for lead co- planarity applies to this type of device? Everybody wants to use the a standard 4 mils but no one can tell me where that requirement is documented. My other concern is the fact that the bottom of the device and not the leads controls the seating plane. I am told that the 4 mils is based on the lowest and highest plane on the leads. I did not get the feeling the bottom of the device was taken into account. Even if it was I am concerned that if the leads are above the seating plane of the body the leads my not fully contact the paste and end up sitting on top. Any clues? Thanks in advanced, --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 -----------------------------------------------------