Hi Arturo, I have answered your question inthe past: There is no pull test specification. And there is a good reason none exists. First, there cannot be such thing as a real 'lead pull test;' while you are of course pulling on the lead, what you are doing to the solder joint is peeling it—the proper reference is a lead-peeling test. Second, the solder joint strength, as determined by a lead peeling test, has no bearing on the reliability of the solder joint, provided the peeling test does not reveal inadequate wetting or poor metallization, e.g., 'Black Pad.' Third, in a peeling test you always need to observe the whole peel-load history for the whole peeling process; with a 1T or larger heel fillet, the largest load will be at the initial portion of peeling through the heel fillet, with l ower loads subsequently depending on whether or not (or to what extent) side fillets are present. Fourth, the fracture surface of the peeled solder joints give typically more information than do the peel-load histories, because the ONLY really important finding is whether or not adequate wetting has taken place, i.e. the separation is mostly in the solder vs. being interfacial. Fifth, the reliability in actual use does to a large extent depend on the heel fillet and the 'bottom flat' wetting; if the foot length is <3W, than also on the presence of a toe fillet, because short feet 'rock' during thermal cycling. Side fillets are less important, unless you have wetting problems. Regards, Werner Engelmaier Engelmaier Associates, L.C. Electronic Packaging, Interconnection and Reliability Consulting 7 Jasmine Run Ormond Beach, FL 32174 USA Phone: 386-437-8747, Fax: 386-437-8737, Cell: 386-316-5904 E-mail: [log in to unmask], Website: www.engelmaier.com --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 -----------------------------------------------------