I'm no board guy either but we have used boards with different laminate thickness and copper weight with no problems as long as like you say the copper distribution is uniform enough. -----Original Message----- From: Stephen Gregory [mailto:[log in to unmask]] Sent: Friday, 25 February 2005 1:18 PM To: [log in to unmask] Subject: Re: [TN] Manufacturability of PCB Stack-up... Actually, I don't know enough about the actual fabrication process to have any...it was our customer who had the question. I guess they were worried (as I said in my earlier post) about the varying dielectric thicknesses posing some sort of difficulty...you just use different prepreg thicknesses to laminate it all up, right? Copper all seems pretty balanced to me, so no warping issues should occur... Me not being a true-blue board guy, I thought this would be a good Technet question... Kind regards, -Steve Gregory- Senior Process Engineer LaBarge Incorporated Tulsa, Oklahoma (918) 459-2285 (918) 459-2350 FAX |---------+-----------------------------> | | "Franklin D | | | Asbell" | | | <fasbell@networkci| | | rcuits.com> | | | | | | 02/25/2005 01:05 | | | PM | | | | |---------+-----------------------------> >---------------------------------------------------------------------------- ----------------------------------| | | | To: "'TechNet E-Mail Forum'" <[log in to unmask]>, <[log in to unmask]> | | cc: | | Subject: RE: [TN] Manufacturability of PCB Stack-up... | >---------------------------------------------------------------------------- ----------------------------------| Steve, That doesn't look difficult at all...what are your concerns??? Franklin D Asbell Network Circuits, Inc. Irving, Texas 75061 972-313-1400 -----Original Message----- From: TechNet [mailto:[log in to unmask]] On Behalf Of Stephen Gregory Sent: Friday, February 25, 2005 12:54 PM To: [log in to unmask] Subject: [TN] Manufacturability of PCB Stack-up... Happy Friday All! I've posted a drawing of a PCB layer stack-up at: http://www.stevezeva.homestead.com/files/Stackup.jpg I'd like to verify its manufacturability. The reason for the verification is that there are dielectric thicknesses that vary quite a bit from layer to layer. Can anybody comment on this? Kind regards, -Steve Gregory- Senior Process Engineer LaBarge Incorporated Tulsa, Oklahoma (918) 459-2285 (918) 459-2350 FAX __________________________________________________________________ This message may contain information that is privileged and confidential to LaBarge, Inc. It is for use only by the individual or entity named above. If you are not the intended recipient, you may not copy, use or deliver this message to anyone. 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