While I was with Siemens, the group developing an injection molded LCP package (Polymer Stud Grid Array) had perfected a process for direct plating on filled LCP (surface and 0.100mm microvias through 0.350mm thick LCP over 5 years ago. Surface metal adhesion was equal to or better than Cu adhesion to dielectric in HDI build-up substrates. Highly adherent surface conductors as fine as 0.050mm lines and spaces were processed non photolithographically using laser structuring of an immersion Sn layer which was used as an in-situ mask for ammoniacal Cu etching. The process die require proprietary processing to make the Cu adhere directly to the LCP. Plating was blister free. Best regards, Leo Director of Applications Engineering ASAT, Inc. 3755 Capital of Texas Highway, Suite 100 Austin, Texas 78704 ph 512-383-4593 fx 512-383-1590 [log in to unmask] www.asat.com The information contained in this electronic message is CUSTOMER/SUPPLIER PRIVILEGED AND CONFIDENTIAL INFORMATION intended only for the use of the individual or entity named above. If the reader of this message is not the intended recipient, you are hereby notified that any dissemination, distribution and copying of this communication is strictly prohibited. If you have received this communication in error, please immediately notify the sender by electronic mail. Thank you. -----Original Message----- From: Dennis Fritz [mailto:[log in to unmask]] Sent: Tuesday, February 01, 2005 8:57 AM To: [log in to unmask] Subject: Re: [TN] Plating on LCP/PPA Moulded devices In a message dated 2/1/2005 9:35:26 AM Eastern Standard Time, [log in to unmask] writes: Last year we tried to plate copper through holes on LCP. Blistered everywhere, top surface, in holes. LCP is interesting resin. To plate electroless copper with adhesion, it needs a special adhesion promotion treatment - a lot different from epoxy glass. I agree, if you just run it down a regular electroless copper line, you will get the worst hole wall pull away you have ever seen. Contact me off line for a copy of the cycle that MacDermid recommends for plating the shielding on LCP connector bodies. The same cycle works on LCP core laminate, and I think would work on molded interconnect devices. Denny Fritz MacDermid --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 ----------------------------------------------------- --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 -----------------------------------------------------