Liquid crystal polymer is being molded onto leadframes by several different suppliers. Several IC subcontract assembly companies, as mentioned below, and including my own, are engaged in qualification work on such packages. One of the leadframe metallurgies being evaluated is a NiPdAu preplated leadframes, eliminating need for plating after LCP injection molding or after package assembly. Best regards, Leo Director of Applications Engineering ASAT, Inc. 3755 Capital of Texas Highway, Suite 100 Austin, Texas 78704 ph 512-383-4593 fx 512-383-1590 [log in to unmask] www.asat.com The information contained in this electronic message is CUSTOMER/SUPPLIER PRIVILEGED AND CONFIDENTIAL INFORMATION intended only for the use of the individual or entity named above. If the reader of this message is not the intended recipient, you are hereby notified that any dissemination, distribution and copying of this communication is strictly prohibited. If you have received this communication in error, please immediately notify the sender by electronic mail. Thank you. -----Original Message----- From: David Greig [mailto:[log in to unmask]] Sent: Monday, January 31, 2005 9:50 AM To: [log in to unmask] Subject: Re: [TN] Plating on LCP/PPA Moulded devices Hi Eric, Assuming that your meaning QFN/MLF style packages from the likes of Amkor/Carsem/Chipmos etc the you can get just about any plating. Sn, SnPb, Ag and Au seems to be on offer, with Sn probably the most common. Seems that most often the platting is carried out before separating the peripheral leadframe, so there's a remnant of unplated Cu on the lower side of the lead edges. There was a publication recently about LCP packages with embedded solder balls and internal die to ball wirebonds. Basically 5 sided with the die facing up and potted with optically transparent resin. Can't quite remember which publication and when (2004). Best Regards David Greig ______________________________ GigaDyne Ltd Buchan House Carnegie Campus Dunfermline KY11 8PL United Kingdom t: +44 (0)1383 624 975 http://www.gigadyne.co.uk ______________________________ -----Original Message----- From: TechNet [mailto:[log in to unmask]] On Behalf Of Eric CHRISTISON Sent: 31 January 2005 14:15 To: [log in to unmask] Subject: [TN] Plating on LCP/PPA Moulded devices I've got an interest in thermoplastic moulded chip packages - I think they're generally done in LCP or PPA. Can anyone tell me what plating system is used with them and, even better, who does it. Thanks, Eric Christison Mechanical Engineer Consumer & Micro Group - Imaging Division STMicroelectronics 33 Pinkhill Edinburgh EH12 7BF Tel: +44 (0)131 336 6165 Fax: +44 (0)131 336 6001 --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 ----------------------------------------------------- -- Virus scanned by Lumison. --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 ----------------------------------------------------- --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 -----------------------------------------------------