Hello all We see the following issue on an ENIG coated PCB (soldered with SnPb): After reflow solder joint is ok but cross section shows a quite irregular IMC phase (about 3 mikrometer thick, not homogenous, looks more like stones on a plane) After the following wave process (component is on the top side) solder joint is very fragile and in the cross section some fractures are seen. Has somebody any picture how a perfect IMC on ENIG should look like? I would expect a homogeous layer just a few nm thick. Any ideas? Siggi --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 -----------------------------------------------------