Interesting comment. We've had an on-going debate about this at my company. An employee attended a seminar where the instructor made the same statement, and has been adamant about it ever since. My experience has been that in high volume, it's less expensive to punch non-plated features, and I was never aware of any quality risks. (By the way, it was done for years for us by PhotoCircuits - a nice apple pie American company - at the time anyway) I'd be interested to hear the experts here weigh in on the issue. Best Regards, -Chris cguitar <[log in to unmask]> To: [log in to unmask] Sent by: TechNet cc: <[log in to unmask]> Subject: Re: [TN] Cracking FR4 02/16/2005 11:08 PM Please respond to TechNet E-Mail Forum; Please respond to cguitar FR4 should never be punched, I believe At 11:54 AM 2/17/2005, you wrote: >Hopefully someone in the forum may have had experience with cracking >along edge of FR4 as per attached photo. The profile of this pcb was >punched and subsequently the edge has fine cracks through the soldermask >and glass. We have had a large quantity of this part made in China and >are concerned that this cracking could compromise the board function. > > > >--------------------------------------------------- >Technet Mail List provided as a service by IPC using LISTSERV 1.8e >To unsubscribe, send a message to [log in to unmask] with following text in >the BODY (NOT the subject field): SIGNOFF Technet >To temporarily halt or (re-start) delivery of Technet send e-mail to >[log in to unmask]: SET Technet NOMAIL or (MAIL) >To receive ONE mailing per day of all the posts: send e-mail to >[log in to unmask]: SET Technet Digest >Search the archives of previous posts at: http://listserv.ipc.org/archives >Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 >for additional information, or contact Keach Sasamori at [log in to unmask] or >847-615-7100 ext.2815 >----------------------------------------------------- --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 ----------------------------------------------------- "This e-mail message is intended only for the use of the intended recipient(s). The information contained therein may be confidential or privileged, and its disclosure or reproduction is strictly prohibited. If you are not the intended recipient, please return it immediately to its sender at the above address and destroy it." --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 -----------------------------------------------------