Can you share the photo with me. Victor, -----Original Message----- From: TechNet [mailto:[log in to unmask]] On Behalf Of Ingemar Hernefjord (KC/EMW) Sent: Thursday, January 27, 2005 10:21 AM To: [log in to unmask] Subject: Re: [TN] Solder tags and tin thickness Dave, you were very close to the truth! We have experienced exactly what you mention. Had to skip whole lot of parts, because they were only partly solderable. I'll send a pic offline to you. The zincificaion brotherhood.. The manufacturers of these tiny things do not seem to take nickel so serious as you and I, because many of them just specify tin over brass. I like both english breakfast and american. I must admit, that I was little bit in doubt about the US early meal appropriateness first time I sat down beside a guy in a typical tramlike bar in Syracuse. Time was about half past six in the morning, I was still halfsleeping, and that guy was digging in a huge stack of pancakes. He drowned the pancakes in syrup and down they went. Then he ordered another stack and ended up with donuts and Coke. Now I make them myself, but use strong english coffee instead of Coke. Dual influence, so as to say. Ingemar -----Original Message----- From: TechNet [mailto:[log in to unmask]] Sent: den 27 januari 2005 14:37 To: [log in to unmask] Subject: Re: [TN] Solder tags and tin thickness Hi Ingemar! Don't forget that if you don't use a barrier metal between the solder joint and the brass pin you have a chance of the solder joint integrity being questionable due to "zincification". Zinc from the brass can potentially diffusion into the solder joint causing problems. Either a nickel or a copper barrier plating of the brass pin will eliminate the phenomena. Oh, an alternative American breakfast would be Diet Coke and a Snickers or Doug's Mt. Dew and a bagel. Remember I said alternative, not healthy! Dave Hillman Rockwell Collins [log in to unmask] "Ingemar Hernefjord (KC/EMW)" To <ingemar.hernefjo [log in to unmask] [log in to unmask]> cc Sent by: TechNet <[log in to unmask]> Subject [TN] Solder tags and tin thickness 01/27/2005 05:45 AM Please respond to TechNet E-Mail Forum <[log in to unmask]> ; Please respond to "Ingemar Hernefjord (KC/EMW)" <ingemar.hernefjo [log in to unmask]> Morning all, what about a simple q while melting first meal of the day? (US:donuts and coffee ; UK:scrambled eggs, black pudding, sausage, marmelade, plums,juice, milk, scones, bacon, coffee, cheese, tomatoes, etc) Solder tags, pin, eyelets for printed boards, pressfit. We have found large variations in tin thickness from various manufacturers. Checked about 20 known makers, and none specified exactly what plating they had. Just 'tinned brass' or 'special high quality tin process' or 'solderable plating' etc. Too thin tin will make the pins less solderable after some months, while exaggerated thickness will cost some extra and cause tolerance problems. So, gentlemen, what do you prefer for a Veroboard pin or a backplane ditto? I've proposed minimum 10 microns over nickel if the pins are brass. Or minimum 25 microns of tin without nickel barrier. Does this sound reasonable? Ingemar Hernefjord Ericsson Microwave Systems --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 ----------------------------------------------------- --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 ----------------------------------------------------- --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 ----------------------------------------------------- --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 -----------------------------------------------------