This technology is in routine volume use for power circuits (e.g. automotive engine management systems) but not using thickfilm inks. By and large the only way to tell the boards are not conventional SMT FR4 is to look at the reverse, which is just plain aluminium. (Then you notice no holes / through components) Regards Mike -----Original Message----- From: TechNet [mailto:[log in to unmask]] On Behalf Of Ingemar Hernefjord (KC/EMW) Sent: Friday, January 14, 2005 8:22 AM To: [log in to unmask] Subject: Re: [TN] Aluminum substrates... any issues? Old idea, used by the car industry up and then. They searched for a possibility to put the circuitry directly on the chassis, but it seemed impractical, so it wasn't successful. We experimented some 20 years ago with anodized aluminium and thickfilm, but the firing temperatures for silver and gold prints were too high. Apparently, your house found a solution on that problem. Another interesting idea,which is focused upon now, is SiC spraying on metal sheets. Withstands very high firing temperatures. SiC on pure Moly ought to withstand anything. The IMAPS folk ought to know about that... Ingemar Hernefjord Ericsson Microwave Systems -----Original Message----- From: TechNet [mailto:[log in to unmask]]On Behalf Of Brooks,Bill Sent: den 13 januari 2005 20:08 To: [log in to unmask] Subject: [TN] Aluminum substrates... any issues? I ran across this supplier of aluminum boards and was interested if any of you have dealt with this type of thing before? I have seen metal core boards made with alumina and bonded with the fiberglass/epoxy for heat sinking needs but this looks like a different process. Possibly less expensive... ??? http://www.irctt.com/pdf_files/thickfilm_aluminum.pdf Any comments on it are appreciated. Best regards, Bill Brooks - KG6VVP PCB Design Engineer , C.I.D.+, C.I.I. 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