Ingemar, I thought they were very nice shots as well!! What bonder/s? :-) Steve -----Original Message----- From: Ingemar Hernefjord (KC/EMW) [mailto:[log in to unmask]] Sent: Friday, January 14, 2005 10:47 AM To: [log in to unmask] Subject: Re: [TN] FAB - Al Wire Bonding No, dear laser woman, doesn't drop performance <1GHz. Short loop=testing worst conditions. No gold=less cost. Cute pic? What associations do you get? Haggish or Bratwurst? Inge -----Original Message----- From: TechNet [mailto:[log in to unmask]]On Behalf Of Joyce Koo Sent: den 14 januari 2005 15:22 To: [log in to unmask] Subject: Re: [TN] FAB - Al Wire Bonding IngeMAR, why Ni? Isn't it effect your performance? I guess it is not signal, it should be OK. Very cute photo... the thicker wire almost shaped to square, is it intentional deformation by the capillary? Thx. jk -----Original Message----- From: TechNet [mailto:[log in to unmask]]On Behalf Of Steve Gregory Sent: Thursday, January 13, 2005 10:57 PM To: [log in to unmask] Subject: Re: [TN] FAB - Al Wire Bonding Hi All! I just got Inge's pictures up...sorry for being so tardy. I'm going through J-STD-001 and IPC-7711/7712 Instructor certification out here in California, and only get to my 'pooter when I get back to my hotel room after school. Go to: _http://www.stevezeva.homestead.com_ (http://www.stevezeva.homestead.com) and look at Bond 1 - 5 -Steve Gregory- Al fine wire, signal only, isn't very demanding, but heavy Al wire (50um and up) combined with high currents can be schrecklich, as Werner would say. Too thick gold and impurities can cause bond lifting after some time of operating at high temperature. If you are uncertain, I'd recommend a night or two in bed reading Harman's wire bonding Bible. I anticipate that you aim at wedge bonding. In fact we've found that you can bond successfully on nickel without any gold at all (don't take it as a recommendation, but just as information). We let the autobonder make thousands of fine wire Al bonds on nickelplated aluminium plates, not one single missing, and wire pull test statistics looked just fine. Asked Steve to hang some typical pics on the wall FYI. Not best quality images, but give you an idea. Two pics 37um and the others 125 um Si-doped Al wire. Interesting to see what other's think about bonding directly on nickel like this.... Ingemar Hernefjord Ericsson Microwave Systems -----Original Message----- From: TechNet [mailto:[log in to unmask]]On Behalf Of John Parsons Sent: den 13 januari 2005 00:32 To: [log in to unmask] Subject: [TN] FAB - Al Wire Bonding Greetings all, I am trying to learn something about the wire bonding process. Our customer has a part on which they spec the finish of some edge connector fingers as "Gold Plated for Wire Bonding Al Wire". As we do not provide a wire bondable gold finish in-house we have subcontracted the service. The plating service tells me that typically for Al wire bonding all that is required is a typical ENIG process (5-10u" Au over 200u" Ni). I believe that in past verbal communications with the customer they have said that an ENIG finish would not suffice and that they require 15u" of bondable gold (electroless gold or electroplated??) . What say you? Or does "it depend" :-) Regards John Parsons --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 ----------------------------------------------------- --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 ----------------------------------------------------- --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 ----------------------------------------------------- --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 -----------------------------------------------------