Choosing Flex (or) rigid depends on the end application considering reliability of the end product in to account. M Muthu Product Engineering Dept No. 99 Lebuhraya Kampung Jawa Taman Perindustrian 11900 bayan Lepas Penang, Malaysia Tel : 6420000 Fax: 6482222 -----Original Message----- From: TechNet [mailto:[log in to unmask]]On Behalf Of Simms, Michael Sent: Saturday, January 08, 2005 6:22 AM To: [log in to unmask] Subject: [TN] FW: Flexible vs. rigid substrates > Hello T'Netters, > Recently, the issue of the use of rigid printed wiring boards in an > application > which demands that printed wiring boards be pressed into an outer shell > with some > degree of curvature has surfaced. > I'm accustomed to the use of flexible substrates for applications which > demand > any form of application in which the board does not stay flat. > However, I don't see any IPC document which mandates the use of rigid > boards > for 180-degree assembly applications and flex boards (or rigid-flex) for > anything else. > Are there any guidelines for the selection of one type over another? > Are there any reliability issues with the use of surface mount devices on > flex boards which don't also apply to rigid boards? > Why would a manufacturer opt for a rigid board over a flex board for > assemblies which > are subsequently flexed? Is this a choice based on cost? > --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 ----------------------------------------------------- --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 -----------------------------------------------------