Greig, I was thinking about the PolymerStudGridArray which is manufactured by Siemens and the various MID devices out there where tracking is deposited onto the thermoplastic. I'm not sure we're talking about the same things here..? Regards, Eric Christison Mechanical Engineer Consumer & Micro Group - Imaging Division STMicroelectronics 33 Pinkhill Edinburgh EH12 7BF Tel: +44 (0)131 336 6165 Fax: +44 (0)131 336 6001 > -----Original Message----- > From: TechNet [mailto:[log in to unmask]] On Behalf Of David Greig > Sent: Monday, January 31, 2005 3:50 PM > To: [log in to unmask] > Subject: Re: [TN] Plating on LCP/PPA Moulded devices > > > Hi Eric, > > Assuming that your meaning QFN/MLF style packages from the > likes of Amkor/Carsem/Chipmos etc the you can get just about > any plating. Sn, SnPb, Ag and Au seems to be on offer, with > Sn probably the most common. Seems that most often the > platting is carried out before separating the peripheral > leadframe, so there's a remnant of unplated Cu on the lower > side of the lead edges. > > There was a publication recently about LCP packages with > embedded solder balls and internal die to ball wirebonds. > Basically 5 sided with the die facing up and potted with > optically transparent resin. Can't quite remember which > publication and when (2004). > > Best Regards > > David Greig > ______________________________ > GigaDyne Ltd > Buchan House > Carnegie Campus > Dunfermline KY11 8PL > United Kingdom > t: +44 (0)1383 624 975 > http://www.gigadyne.co.uk > ______________________________ > > -----Original Message----- > From: TechNet [mailto:[log in to unmask]] On Behalf Of Eric CHRISTISON > Sent: 31 January 2005 14:15 > To: [log in to unmask] > Subject: [TN] Plating on LCP/PPA Moulded devices > > I've got an interest in thermoplastic moulded chip packages - > I think they're generally done in LCP or PPA. > > Can anyone tell me what plating system is used with them and, > even better, who does it. > > Thanks, > > Eric Christison > Mechanical Engineer > Consumer & Micro Group - Imaging Division STMicroelectronics > 33 Pinkhill > Edinburgh > EH12 7BF > > Tel: +44 (0)131 336 6165 > Fax: +44 (0)131 336 6001 > > --------------------------------------------------- > Technet Mail List provided as a service by IPC using LISTSERV > 1.8e To unsubscribe, send a message to [log in to unmask] with > following text in the BODY (NOT the subject field): SIGNOFF > Technet To temporarily halt or > (re-start) delivery of Technet send e-mail to > [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE > mailing per day of all the posts: send e-mail to > [log in to unmask]: SET Technet Digest Search the archives of > previous posts at: http://listserv.ipc.org/archives Please > visit IPC web site > http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for > additional information, or contact Keach Sasamori at > [log in to unmask] or 847-615-7100 ext.2815 > ----------------------------------------------------- > -- > Virus scanned by Lumison. > > --------------------------------------------------- > Technet Mail List provided as a service by IPC using LISTSERV > 1.8e To unsubscribe, send a message to [log in to unmask] with > following text in the BODY (NOT the subject field): SIGNOFF > Technet To temporarily halt or (re-start) delivery of Technet > send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) > To receive ONE mailing per day of all the posts: send e-mail > to [log in to unmask]: SET Technet Digest Search the archives > of previous posts at: http://listserv.ipc.org/archives Please > visit IPC web site > http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for > additional information, or contact Keach Sasamori at > [log in to unmask] or 847-615-7100 ext.2815 > ----------------------------------------------------- > --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 -----------------------------------------------------