You are probably used to looking at Hot Air Solder Leveled boards that have solder as the surface finish. Solder "levels" an uneven surface. The various immersion coatings do not do this so the topography of the hole wall is very evident. The glass bundles may very well be completely covered with one mil of copper, but would leave a "lump" along the hole wall. If your boards have etchback you could see a lump at the inner layers. Some copper plating baths also level their deposits, but most will give you an uneven topography. Susan Mansilla Robisan Laboratory --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 -----------------------------------------------------