You can get at it the same way you would for the TechNet archives. Here is a link to the IPC.org forums page. http://www.ipc.org/contentpage.asp?Pageid=4.3 Just click on the archive you want to look at. -----Original Message----- From: Hughes, Chris [mailto:[log in to unmask]] Sent: January 12, 2005 11:36 AM To: [log in to unmask] Subject: Re: [TN] Soldering LeadFree components with SnPb Hi Genny I'd be interested to take a look at the IPC forum. You couldn't send me a link to it could you? Thanks in advance Chris Christopher Hughes Environmental Scientist [log in to unmask] -----Original Message----- From: Genny Gibbard [mailto:[log in to unmask]] Sent: 12 January 2005 15:32 To: [log in to unmask] Subject: Re: [TN] Soldering LeadFree components with SnPb In a discussion last week on the Lead free forum, I started a thread on Bismuth. Many interesting comments were received. You should check the archives of the IPC Leadfree forum for not only that thread but other info on Bismuth - there is a lot of info on that forum. NEC/CEL has a document on their site that lists some interesting info re using a SnBi finish in a Pb process. They claim that the amount of Bi on a component termination is not high enough to cause the weak low melting point PbBi intermetallic that causes the problems. -----Original Message----- From: Jack C. Olson [mailto:[log in to unmask]] Sent: January 12, 2005 9:26 AM To: [log in to unmask] Subject: [TN] Soldering LeadFree components with SnPb I have a question for the assembly folks out there; We just recieved notification that one of our connectors is no longer available with tin/lead plating contacts, and that they are now tin/bismuth. I searched the last two years of Technet archives for the word "bismuth" and only found this one comment with no other responses: (there were other posts with "bismuth", but not relevant) -=-=- Some component lead-free finishes are not compatible with current tin/lead assembly processing. Bismuth can weaken tin-lead solder joints. Tin finishes should only be matte (no brighteners) or fully annealed (low stress to ensure against tin whiskers that can ruin satellites and cause fires). Karl Sauter Staff Engineer, Engineering Technologies Sun Microsystems Inc. -=-=- We are NOT using a lead-free assembly process. Someone give me some good news.... PLEASE! Jack --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 ----------------------------------------------------- --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 ----------------------------------------------------- --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 ----------------------------------------------------- --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 -----------------------------------------------------