Good Questions. Also...What type of solder paste are you using? What does your recipe/profile look like? Ramp, Soak, Reflow times and temps? What is the thermal mass of the board? Ex: # Layers, Thickness, Type of Layers? Is this the only component that did not reflow well? -Carrie -----Original Message----- From: TechNet [mailto:[log in to unmask]] On Behalf Of David D. Hillman Sent: Wednesday, December 01, 2004 10:06 AM To: [log in to unmask] Subject: Re: [TN] Help, Help, I have a QFN Package I don't know what to do! Hi Kevin! What is the lead finish of the QFN package? Having that information will helpful to the TechNetee's in assisting you. Also, what are the package dimensions? Dave Hillman Rockwell Collins [log in to unmask] G'day Everyone. Well as the subject states we are currently running a prototype assembly with a new package style to me, a QFN (Quad Flat No-lead). I had to look that one up myself. The problem is when we were trying to reflow the part, the solder joint looks very poor, with little to no solder seen on the edge of the component lead and the pad on the PCB, or a bubble of solder seen on end of the component between the edge of the component lead and the pad of the PCB. I'm currently setting up to X-ray the components to see if the foot actually has a good solder joint underneath the component, where the lead has been curled around the component, but has anyone else had any dealings with this particular component type before and would be willing to share? I looked up the component manufacture's website and they show that this component has a required peak temperature of 235 (+5/-0) degrees C. That seems like a lot of heat for a non lead-free component. Feel free to email me offline if anyone likes. Thanks in advance. Kevin Jaworenko Manufacturing Engineering Technologist Vansco Electronics LP (204) 453 - 3339 ext. 622 (204) 453 - 3663 FAX [log in to unmask] --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 ----------------------------------------------------- --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 -----------------------------------------------------