Bob, in german we have a spoken word which goes like "My mind is willing, only the flesh is weak ..." Don´t copy David´s penalty performance! Gebhard _______________________________ Delphi Deutschland GmbH Body & Security Electronics Manufacturing Engineering Design Albert Einstein Straße 5 D-51674 Wiehl-Bomig Tel.: +49 (0)2261-971-880 Fax: +49 (0)2261-972-880 Mobile: +49 (0)151-18223504 E-mail: [log in to unmask] -----Ursprüngliche Nachricht----- Von: TechNet [mailto:[log in to unmask]] Im Auftrag von Bob willis Gesendet: Mittwoch, 24. November 2004 17:00 An: [log in to unmask] Betreff: Re: [TN] Video analysis of solder joint formation Yes you are right; I was trying to be helpful so the forum could look at this area only. As I run the site I should know this. I will sort out links separately TOMMOROW; I have to go to soccer practice now. After watching the David BeckHam DVD I have these new skills to tryout. Well the mind knows what to do it's the legs I have TO SORT OUT. Bob Willis 2 Fourth Ave, Chelmsford, Essex, CM1 4HA, England Tel: 01245 351502 Fax: 01245 496123 Mobile: 07860 775858 Email: [log in to unmask] Web: www.leadfreesoldering.com Web: www.bobwillis.co.uk -----Original Message----- From: TechNet [mailto:[log in to unmask]] On Behalf Of Pasquito, Helena Sent: 24 November 2004 15:34 To: [log in to unmask] Subject: Re: [TN] Video analysis of solder joint formation Bob, I am not able to access the site without a password. Helena Pasquito -----Original Message----- From: TechNet [mailto:[log in to unmask]]On Behalf Of Bob willis Sent: Wednesday, November 24, 2004 9:12 AM To: [log in to unmask] Subject: [TN] Video analysis of solder joint formation Following a number of emails from TECHNET on video simulations, just though I would show a few we have featured on the SMART Group web site over the last few years. Thanks to Dave Hillman and Doug Pauls for letting me know of the interest at the SMART Group Conference last week. RealPlayer is available to download free from a variety of location. QFP Cracking/Popcorning BGA Popcorning PCB Delamination BGA Solder Short Inspection Immersion Testing Components (the Components where in my jacket honest) Lead-Free Chip Tombstone Outgassing from Via Holes Solder Balling During Wave Soldering Solder Beading During Reflow Slow Wetting on Surface Mount Pads Poor Component Solderability Solder Balling of Solder Paste Copper Dendrite Growth on PCB Component Loss on Double Sided Reflow Outgassing from Solder Mask during Wave Contact Component Floating on Paste 0201 Chip Component Lifting Outgassing During Soldering of PTH Secondary Reflow of Lead-Free Joints http://www.smartgroup.org/members/defectvid.asp Have a great thanks giving break over there Bob Willis --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 ----------------------------------------------------- --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 ----------------------------------------------------- --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 ----------------------------------------------------- **************************************************************************************** Note: The information contained in this message may be privileged and confidential and thus protected from disclosure. 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