Yannic The so called lead containing component platings contain 5%Pb. Its really not a big deal, you may as well solder lead free components (except BGAs). I believe your wetting problems are more on the side of the solder parameters, the age of the components or the flux. Best regards Guenter EMPA Swiss Federal Laboratories for Materials Testing and Research Centre for Reliability Guenter Grossmann, Senior Engineer 8600 Duebendorf Switzerland Phone: xx41 1 823 4279 Fax : xx41 1 823 4054 mail: [log in to unmask] --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 -----------------------------------------------------