Dear colleagues Thanks a lot for your answers regarding my question. It seems as if there are several expressions for the panels, assembly panels, arrays etc. Now, since we represent quite a bit of the worldwide electronic production industry and since the forum is run by IPC and we all like cookies and apfelstrudel (with vanilla sauce), I suggest that IPC starts a standardisation on these parts. Like the semiconductor guys who took the chips we could use: - Cake for the panels without components - Apfelstrudel for the assembled and soldered Cakes - Cooky for the destrudeld apfelstrudels Have a great weekend Guenter EMPA Swiss Federal Laboratories for Materials Testing and Research Centre for Reliability Guenter Grossmann, Senior Engineer 8600 Duebendorf Switzerland Phone: xx41 1 823 4279 Fax : xx41 1 823 4054 mail: [log in to unmask] --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 -----------------------------------------------------