I'm trying to learn more about and evaluate the fluxes we use in our no- clean hand soldering processes in a contract manufacturing environment. In the IPC-HDBK-001 "Handbook and Guide to Supplement J-STD-001", table 4-13B includes "recommendations" for class 2 product that basically says to use only an L0, L1 or M0 rated flux for RO and RE type fluxes if the residues are to be left on the board. However, I'm told one of the tried and true flux cores for 63/37 wire is the Kester #44, which has a ROM1 flux designator. On top of that, I'm told that when supplemental flux is needed, an ROM1 liquid flux is often used, again without removing the residues. Should we really be backing away from the ROM1 fluxes for no-clean/don't clean hand soldering processes? I'm going to have a hard time selling that when the Kester #44 is a long time industry standard. Won't a lower activity flux be problematic for the more difficult finshes like palladium, immersion tin and immersion silver? Thanks for your comments Dave Sorg Manufacturing Engineer Servatron 509-891-3137 [log in to unmask] --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 -----------------------------------------------------