none of the links work -----Original Message----- From: TechNet [mailto:[log in to unmask]]On Behalf Of Bob willis Sent: Monday, November 29, 2004 11:14 AM To: [log in to unmask] Subject: Re: [TN] Die Penetrant SJ Crack Inspection Process Here is a link to a short paper on dye testing, don't get on your fingers as its stays red or yellow for a few days. www.bobwillis.co.uk/guide/BGA Dye Testing.pdf Also the guy at Universal Instruments did a couple of good papers as well. There are a few more links as well. www.bobwillis.co.uk/guide/VP Soldering Lead Free.pdf www.bobwillis.co.uk/guide/0201 Design Assembly.pdf www.bobwillis.co.uk/guide/Component Cleaning Tests.pdf www.bobwillis.co.uk/guide/Lead Free Component Requirements.pdf www.bobwillis.co.uk/guide/PCB Pad Design.pdf www.bobwillis.co.uk/guide/PPM DPMO Monitoring your Process.pdf www.bobwillis.co.uk/guide/Solder Beading.pdf Bob Willis 2 Fourth Ave, Chelmsford, Essex, CM1 4HA, England Tel: 01245 351502 Fax: 01245 496123 Mobile: 07860 775858 Email: [log in to unmask] Web: www.leadfreesoldering.com Web: www.bobwillis.co.uk -----Original Message----- From: TechNet [mailto:[log in to unmask]] On Behalf Of Newland, Scott Sent: 29 November 2004 15:56 To: [log in to unmask] Subject: [TN] Die Penetrant SJ Crack Inspection Process I'm going to be performing some long duration thermal cycling testing on some CGA components that will not be electronically monitored for opens. This is not my preferred approach, but a reasonable daisy chain test component was not available. My current plan is to periodically remove parts and cross section the outside rows. I also wanted to try using die penetrant to inspect for SJ cracks. As I understand the process you flooding the SJ under the part with Die penetrant, clean, then pull the parts off vertically, and inspect for pre-existing cracks marked by the die. Is the die penetrant inspection worth while? Does anyone have or know of a written procedure for using die penetrant to inspect for SJ cracks? Any other suggestions for identifying the "needle in the hay stack" cracks? Scott Newland Harris GSCD 321 727 6472 Pager 321 690 4131 E-Mail [log in to unmask] For a brain teaser try: http://pao.gsfc.nasa.gov/science.html This information is only intended for the use of the individual or entity named in this email. If you are not the intended recipient, you are hereby notified that any disclosure, copying, distribution, or use of the contents of this information is strictly prohibited. If you have received this email in error, please notify me and delete it immediately. --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 ----------------------------------------------------- --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 ----------------------------------------------------- --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 -----------------------------------------------------