Hi all, Besides the process of tenting vias what other options are available for plugging vias on a board? Solder? Epoxy? ???? What sort of cost differences are we talking about. When using the tenting method have any of you experienced breakage in the mask barrier, during assembly or rework intervals? We are experiencing is degradation of the vias that exist under quad packages after rework. Especially if quad packages are on both sides of the board, directly over each other. Remove one for rework the flux goes through the vias and takes up residence under the quad on the opposite side of the board. Our dunk type ultrasonic cleaner doesn't seem to be able to wash the flux etc. out from under the quads. We do not work with high volume of anything so any equipment recommendations should be on the moderate side. Any experience on these matters you can pass along will be greatly appreciated. Dee Stover [log in to unmask] Sr. Tech Associate Elect National Optical Astronomy Observatory 950 N Cherry Ave Tucson, AZ 85719 www.noao.edu 520-318-8489 FAX 520-318-8303 --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 -----------------------------------------------------