The immersion silver we use has a co-deposited organic solder preservative. That might be what they mean. I'd be very careful about running electroless nickel through an immersion silver process. I'm not an expert on this, but I would think the immersion silver process would be setup specifically to work on copper. Depositing on a different base metal might give a completely different result. If you get a deposit, it might not be solderable, the thickness may be vastly different than what you get with silver. As bad as that seems, the real concern I have is the effect on your immersion silver process when you run a different metal through it. By adding nickel to the bath, you may contaminate it and ruin your normal silver surface finish. Perhaps someone who knows more about this can confirm or deny this. -----Original Message----- From: TechNet [mailto:[log in to unmask]] On Behalf Of James Hofer Sent: Thursday, November 04, 2004 10:41 AM To: [log in to unmask] Subject: [TN] Immersion Silver I have a customer asking for Imm Silver over 100um NI. I am concerned putting the Silver over the NI as it may lift or peel. This is the first time I have had this kind of request. Have any of you well informed Tech Heads heard of this before??? ps. This customer also asked for OSP over the Silver over the NI. I KNOW that is not done. Thanks for any feedback, James Hofer --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 ----------------------------------------------------- --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 -----------------------------------------------------