Has anyone replaced their old OSP with the Entek Plus Cu106A HT (high temperature)on standard tin/lead processes? We don't have lead-free processes yet but our board vendors would like us to use this material now as they convert. It is supposed to provide significantly improved performance for lead-free. It is not supposed to impact solderability for eutectic tin/lead soldering processes. We will be evaluating some samples but are looking for someone who might have tried this in their processes. Thanks, Cheryl --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 -----------------------------------------------------