Has anyone replaced their old OSP with the Entek Plus Cu106A HT (high
temperature)on standard tin/lead processes? We don't have lead-free
processes yet but our board vendors would like us to use this material now
as they convert. It is supposed to provide significantly improved
performance for lead-free. It is not supposed to impact solderability for
eutectic tin/lead soldering processes. We will be evaluating some samples
but are looking for someone who might have tried this in their processes.

Thanks, Cheryl

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