Jason, did both solder pastes have the same flux chemistry? -----Original Message----- From: TechNet [mailto:[log in to unmask]]On Behalf Of Daan Terstegge Sent: Tuesday, October 26, 2004 4:00 PM To: [log in to unmask] Subject: Re: [TN] Question about 2% Ag and stencil release Hi Jason, I don't believe this has anything to do with silver. The fine powder of your type 5 paste has a MUCH larger ratio between soldersurface and soldervolume than the part 3 type, which means that it is more difficult to keep the powder particles stable and oxide-free. The smaller process window increases the chance of printing problems. Hopefully a more accurate description will be given by one of the paste manufacturers on this forum, but I think I'm pretty close.... Best regards, Daan http://www.smtinfo.net ----- Original Message ----- From: "Jason Gregory" <[log in to unmask]> To: <[log in to unmask]> Sent: Tuesday, October 26, 2004 9:44 PM Subject: [TN] Question about 2% Ag and stencil release > Has anybody had any experience or seen/written studies involving 2% Ag > release from stencil apertures? We have a stencil, parts are small resnets, > about 15 mil pitch on a .006" thick stencil. Tried 2% silver paste (for > tombstoning of other parts) with type 5 powder and had major release > problems. We kept the same parameters on the screen printer (for > reference/control purposes) and swapped in our "normal" 63/37 Type 3 powder > and release issues "virtually" went away. Not all the way, but for the most > part. I thought smaller mesh should have meant better release. Solder > gurus ------- enlighten me! > > Jason Gregory > Manufacturing Engineer > Innova Electronics > (281)653-5593 > (281)653-5594 fax > (281)310-7588 cell > [log in to unmask] > > --------------------------------------------------- > Technet Mail List provided as a service by IPC using LISTSERV 1.8e > To unsubscribe, send a message to [log in to unmask] with following text in > the BODY (NOT the subject field): SIGNOFF Technet > To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) > To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest > Search the archives of previous posts at: http://listserv.ipc.org/archives > Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 > ----------------------------------------------------- > > --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 ----------------------------------------------------- --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 -----------------------------------------------------