In a former life, I used Alpha Metals WS-609, 90% metal and flux activity ORH0. Dependent on your throughput, the only drawbacks are a 4 hour stencil life and 6 hour tack time. A typical reflow profile is recommended with time above liquidus to be 45 - 75 seconds. The flux residue can be easily removed with 140°F water (w/o saponification) in a timely manner. This paste formulation has been around for quite awhile. With that said, there are probably other formulations that are available but I don't have any personal experience with them as I have gone backwards in my career and have been somewhat forced to use a RMA formulation. Good luck with your search. Steve Sauer Sr. Manufacturing Engineer Northrop Grumman, Electronic Systems Xetron Cincinnati, OH -----Original Message----- From: Marsico, James [mailto:[log in to unmask]] Sent: Wednesday, October 20, 2004 2:07 PM To: [log in to unmask] Subject: [TN] solder paste Hello Technet... My solder paste manufacturer, who shall remain nameless, is discontinuing our presently used water soluble paste, so I'm looking for a replacement. What seems to be the most widely used water soluble Sn63 solder paste these days? --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 -----------------------------------------------------