I would like to know how to accomplish burr free plated castellation tab routing and or scoring. We are seeing plating slivers coming off during masking. Our process is drill, electroless, tab route array, copper flash, image , second plate copper and tinlead, etch, mask and route array. The design is such that copper extends all the way to the edge of the board. Tab routing after electroless we see a burr free edge but after strike and second plate, the copper foil on the edge gets overplated and when we go to mask we run into sliver problems. Even if we recess the copper a bit from the edge of the board (5mls) than in imaging we are having problems for the 5ml laminar to adhere to the edge of the board after developing. Material is FR4. Appreciate your input. Sona Sitapara --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 -----------------------------------------------------