phil, dream on phil. it just start come back big time. Check qfn (jedec MO 220)... jk -----Original Message----- From: TechNet [mailto:[log in to unmask]]On Behalf Of Crepeau, Phil Sent: Friday, October 15, 2004 2:30 PM To: [log in to unmask] Subject: Re: [TN] LCC process and manufacturing recommendations hi, i thought these puppies died some time ago. solder joint cracking is dependent on, among other things, the physical size of the package. the greater the diagonal length the greater the chance of solder joint cracking. you should discourage the use of these packages. if the customer insists on using them, they should put leads on them which isn't all that difficult. otherwise you need to go to substates that come close to matching the cte of ceramic (like a kevlar reinforced laminate). an additional help would be to add dry film bumps under the lccs to keep them from settling down onto the pwb. phil -----Original Message----- From: TechNet [mailto:[log in to unmask]]On Behalf Of [log in to unmask] Sent: Friday, October 15, 2004 10:52 AM To: [log in to unmask] Subject: [TN] LCC process and manufacturing recommendations Fellow technetters, I taught of using Technet's pool of knowledge to get some recommendations on LCC type devices. We have a customer asking questions on this package, and all I know is that there are concerns of solder joint cracking due to board/ceramic CTE mismatch. What are the pros and cons of LCC devices? Process and manufacturing recommendations? Solder joint reliability? Reliability under extreme environment conditions? Any comment would be greatly appreciated. Thanks! Jorge A Rodriguez Sr. Process Engineer Varian, Inc 480-968-6790 X 4258 [log in to unmask] --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 ----------------------------------------------------- --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 ----------------------------------------------------- --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 -----------------------------------------------------