Bonjour Yannik, I suggest you start by checking Daan's http:\\www.smtinfo.net, as there are some pretty neat articles there. And then, I assume you have serious reasons for not using pallets. With ICs going to wave, even if they are SOICs, any variance in the process would create solder bridges. Regards, Ioan > -----Original Message----- > From: Yannick Brisson [SMTP:[log in to unmask]] > Sent: Friday, October 08, 2004 10:46 AM > To: [log in to unmask] > Subject: [TN] Glue printing > > Hi, > > We need to produce a large quantite of board double side. We are > thinking about glueing one side. On this side there are some SOIC 14pins, > 0805, 1206, and a aluminum capacitor case D, I'm wondering if someone > could > give me some hint on what to do with the stencil. The guys is suggest to > use .006" thick, and the aperture of 33% of the gap and 110% of the width > on > the passive component but we don't know about the SOIC and the aluminum > capacitor. I don't know if there is anyway to know the amount of glue > left > on the board, for the SOIC I know someone who try to glue the component > with > a stencil but he said that he need to put manually more glue cause the IC > fall in the wave. I don't want to do that. > > Thank You > > Yannick > > --------------------------------------------------- > Technet Mail List provided as a service by IPC using LISTSERV 1.8e > To unsubscribe, send a message to [log in to unmask] with following text in > the BODY (NOT the subject field): SIGNOFF Technet > To temporarily halt or (re-start) delivery of Technet send e-mail to > [log in to unmask]: SET Technet NOMAIL or (MAIL) > To receive ONE mailing per day of all the posts: send e-mail to > [log in to unmask]: SET Technet Digest > Search the archives of previous posts at: http://listserv.ipc.org/archives > Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 > for additional information, or contact Keach Sasamori at [log in to unmask] or > 847-509-9700 ext.5315 > ----------------------------------------------------- --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 -----------------------------------------------------